Invention Grant
- Patent Title: Split-layer design for double patterning lithography
- Patent Title (中): 双层图案平版印刷的分层设计
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Application No.: US12915923Application Date: 2010-10-29
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Publication No.: US08347240B2Publication Date: 2013-01-01
- Inventor: Kanak B. Agarwal , Lars W. Liebmann , Sani R. Nassif
- Applicant: Kanak B. Agarwal , Lars W. Liebmann , Sani R. Nassif
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Francis Lammes; Stephen J. Walder, Jr.; Libby Z. Toub
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F19/00 ; G03F1/00 ; G21K5/00

Abstract:
A mechanism is provided for converting a set of single-layer design rules into a set of split-layer design rules for double patterning lithography (DPL). The set of single-layer design rules and minimum lithographic resolution pitch constraints for single exposure are identified. The set of single-layer design rules comprise a first plurality of minimum distances that are required by a set of first shapes in a single-layer design. Each of the first plurality of minimum distances in the set of single-layer design rules are modified with regard to the minimum lithographic resolution pitch constraints for single exposure, thereby forming the set of split-layer design rules. The set of split-layer design rules comprise a second plurality of minimum distances that are required by a set of second shapes and a set of third shapes in a split-layer design. The set of split-layer design rules are then coded into a design rule checker.
Public/Granted literature
- US20120110521A1 Split-Layer Design for Double Patterning Lithography Public/Granted day:2012-05-03
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