Invention Grant
- Patent Title: Connecting structure for circuit board and connecting method using the same
- Patent Title (中): 电路板的连接结构及其连接方法
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Application No.: US12659556Application Date: 2010-03-12
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Publication No.: US08350162B2Publication Date: 2013-01-08
- Inventor: Hyun Tae Kim , Tae Sang Park , Young Jun Moon , Soon Min Hong , Hyo Young Shin
- Applicant: Hyun Tae Kim , Tae Sang Park , Young Jun Moon , Soon Min Hong , Hyo Young Shin
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2009-0024884 20090324
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
Disclosed is a connection structure for a circuit board using a solder bump to arrange circuit boards. The circuit board connection structure includes a solder bump prepared on one of two circuit boards and a perforated part formed at the other of the circuit boards to receive the solder bump. Facing both circuit boards towards each other and inserting the solder bump into the perforated part, the circuit boards are desirably arranged.
Public/Granted literature
- US20100243309A1 Connecting structure for circuit board and connecting method using the same Public/Granted day:2010-09-30
Information query
