Invention Grant
- Patent Title: Polycrystalline diamond cutting element structure
- Patent Title (中): 多晶金刚石切割元件结构
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Application No.: US12963088Application Date: 2010-12-08
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Publication No.: US08353370B2Publication Date: 2013-01-15
- Inventor: Federico Bellin , Yi Fang , Michael Stewart , Nephi M. Mourik , Peter Thomas Cariveau
- Applicant: Federico Bellin , Yi Fang , Michael Stewart , Nephi M. Mourik , Peter Thomas Cariveau
- Applicant Address: US TX Houston
- Assignee: Smith International, Inc.
- Current Assignee: Smith International, Inc.
- Current Assignee Address: US TX Houston
- Agency: Osha Liang LLP
- Main IPC: E21B10/36
- IPC: E21B10/36

Abstract:
A cutting element includes a substrate having an interface surface; and an ultrahard material layer disposed on the interface surface. An interface surface includes a plurality of surface features, wherein at least one of the plurality of surface features intersects a neighboring surface feature at a height that is intermediate an extremity of the at least one of the plurality of surface features and a base of the at least one of the plurality of surface features.
Public/Granted literature
- US20110132668A1 POLYCRYSTALLINE DIAMOND CUTTING ELEMENT STRUCTURE Public/Granted day:2011-06-09
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