Invention Grant
- Patent Title: Terminal structures for wiring devices
- Patent Title (中): 接线端子结构
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Application No.: US12967493Application Date: 2010-12-14
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Publication No.: US08353716B2Publication Date: 2013-01-15
- Inventor: Sushil N. Keswani
- Applicant: Sushil N. Keswani
- Applicant Address: US IL Sycamore
- Assignee: IDEAL Industries, Inc.
- Current Assignee: IDEAL Industries, Inc.
- Current Assignee Address: US IL Sycamore
- Agency: Cook Alex Ltd.
- Main IPC: H01R13/627
- IPC: H01R13/627

Abstract:
Terminal structures for wiring devices, such as receptacle assemblies, are disclosed having first and second spring assemblies constructed of a first metal and each having at least one spring finger with the first and second spring assemblies being connected to respective first and second conductive contacts that are constructed of a second metal, wherein the terminal structures are configured for push-in termination of conductive stripped ends of respective first and second wires between the at least one spring finger of the respective first and second spring assemblies and the respective first and second conductive contacts, and wherein the first and second conductive contacts are configured to be connected to respective first and second separate conductive elements. Such a terminal structure is shown for example within a receptacle assembly in the form of a grounding duplex plug outlet.
Public/Granted literature
- US20120149231A1 Terminal Structures for Wiring Devices Public/Granted day:2012-06-14
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