Invention Grant
US08354014B2 Palladium complex and catalyst-imparting treatment solution using the same
有权
钯络合物和使用其的催化剂赋予处理溶液
- Patent Title: Palladium complex and catalyst-imparting treatment solution using the same
- Patent Title (中): 钯络合物和使用其的催化剂赋予处理溶液
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Application No.: US12096027Application Date: 2006-11-02
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Publication No.: US08354014B2Publication Date: 2013-01-15
- Inventor: Makoto Kohtoku , Mika Hamada
- Applicant: Makoto Kohtoku , Mika Hamada
- Applicant Address: JP Tokyo
- Assignee: Ebara-Udylite Co., Ltd.
- Current Assignee: Ebara-Udylite Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-351998 20051206
- International Application: PCT/JP2006/321941 WO 20061102
- International Announcement: WO2007/066460 WO 20070614
- Main IPC: C25D5/56
- IPC: C25D5/56 ; C23C28/02 ; C23C18/20 ; C23C18/28 ; C23C18/30

Abstract:
There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.
Public/Granted literature
- US20100047458A1 PALLADIUM COMPLEX AND CATALYST-IMPARTING TREATMENT SOLUTION USING THE SAME Public/Granted day:2010-02-25
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