Invention Grant
- Patent Title: Co-molded direct flock and flock transfer and methods of making same
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Application No.: US12013996Application Date: 2008-01-14
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Publication No.: US08354050B2Publication Date: 2013-01-15
- Inventor: Louis Brown Abrams
- Applicant: Louis Brown Abrams
- Applicant Address: US CO Fort Collins
- Assignee: High Voltage Graphics, Inc.
- Current Assignee: High Voltage Graphics, Inc.
- Current Assignee Address: US CO Fort Collins
- Agency: Sheridan Ross P.C.
- Main IPC: B29C45/14
- IPC: B29C45/14

Abstract:
A method of decorating a molded article is provided that includes the steps of: (a) providing a mold insert comprising a plurality of flock fibers and a permanent adhesive layer; (b) positioning the mold insert in a mold; and (c) introducing resin into the mold, such that a resin contacts the mold insert to form a molded article. The melting point of the permanent adhesive layer is preferably greater than a temperature of the resin during molding.
Public/Granted literature
- US20080150186A1 CO-MOLDED DIRECT FLOCK AND FLOCK TRANSFER AND METHODS OF MAKING SAME Public/Granted day:2008-06-26
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