Invention Grant
- Patent Title: Resist composition and method of forming resist pattern
- Patent Title (中): 抗蚀剂图案的抗蚀剂组成和方法
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Application No.: US12820899Application Date: 2010-06-22
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Publication No.: US08354218B2Publication Date: 2013-01-15
- Inventor: Isao Hirano , Toshiaki Hato
- Applicant: Isao Hirano , Toshiaki Hato
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JPP2009-158145 20090702
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/30

Abstract:
A resist composition that includes a base component (A) that exhibits changed solubility in an alkali developing solution under the action of acid, an acid generator component (B) that generates acid upon exposure, and an epoxy resin (G). Also, a method of forming a resist pattern that includes using the above resist composition to form a resist film on the substrate, conducting exposure of the resist film, and alkali-developing the resist film to form a resist pattern.
Public/Granted literature
- US20110039207A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN Public/Granted day:2011-02-17
Information query
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