Invention Grant
US08354283B2 Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump
失效
制造具有凸块/底座/凸缘散热器的半导体芯片组件的方法，双重粘合剂和凸块中的空腔
- Patent Title: Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump
- Patent Title (中): 制造具有凸块/底座/凸缘散热器的半导体芯片组件的方法，双重粘合剂和凸块中的空腔
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Application No.: US13337164Application Date: 2011-12-26
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Publication No.: US08354283B2Publication Date: 2013-01-15
- Inventor: Charles W. C. Lin , Chia-Chung Wang
- Applicant: Charles W. C. Lin , Chia-Chung Wang
- Applicant Address: TW Taipei
- Assignee: Bridge Semiconductor Corporation
- Current Assignee: Bridge Semiconductor Corporation
- Current Assignee Address: TW Taipei
- Agency: Jackson IPG PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of making a semiconductor chip assembly includes providing a bump and a ledge, mounting a first adhesive on the ledge including inserting the bump into an opening in the first adhesive, mounting a conductive layer on the first adhesive including aligning the bump with an aperture in the conductive layer, then flowing the first adhesive between the bump and the conductive layer, solidifying the first adhesive, then providing a heat spreader that includes the bump, a base and the ledge, then mounting a second adhesive on the ledge, mounting a conductive trace that includes a pad and a terminal on the second adhesive, then mounting a semiconductor device on the bump in a cavity in the bump, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
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