Method to optimize work function in complementary metal oxide semiconductor (CMOS) structures

Invention Grant

US08354313B2 Method to optimize work function in complementary metal oxide semiconductor (CMOS) structures 有权

Title translation: 在互补金属氧化物半导体（CMOS）结构中优化功函数的方法

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Patent Title: Method to optimize work function in complementary metal oxide semiconductor (CMOS) structures
Patent Title (中): 在互补金属氧化物半导体（CMOS）结构中优化功函数的方法
Application No.: US12770792

Application Date: 2010-04-30
Publication No.: US08354313B2

Publication Date: 2013-01-15
Inventor: Unoh Kwon , Dechao Guo , Siddarth A. Krishnan , Ramachandran Muralidhar
Applicant: Unoh Kwon , Dechao Guo , Siddarth A. Krishnan , Ramachandran Muralidhar
Applicant Address: US NY Armonk
Assignee: International Business Machines Corporation
Current Assignee: International Business Machines Corporation
Current Assignee Address: US NY Armonk
Agency: Scully, Scott, Murphy & Presser, P.C.
Agent H. Daniel Schnurmann
Main IPC: H01L21/8236
IPC: H01L21/8236 ; H01L21/8234 ; H01L21/4763

Method to optimize work function in complementary metal oxide semiconductor (CMOS) structures

Abstract:

In one embodiment, the method for forming a complementary metal oxide semiconductor (CMOS) device includes providing a semiconductor substrate including a first device region and a second device region. An n-type conductivity semiconductor device is formed in one of the first device region or the second device region using a gate structure first process, in which the n-type conductivity semiconductor device includes a gate structure having an n-type work function metal layer. A p-type conductivity semiconductor device is formed in the other of the first device region or the second device region using a gate structure last process, in which the p-type conductivity semiconductor device includes a gate structure including a p-type work function metal layer.

Abstract(Chinese):

在一个实施例中，形成互补金属氧化物半导体（CMOS）器件的方法包括提供包括第一器件区域和第二器件区域的半导体衬底。使用栅极结构第一工艺在第一器件区域或第二器件区域之一中形成n型导电性半导体器件，其中n型导电性半导体器件包括具有n型功函数金属层的栅极结构。使用栅极结构最后工艺在第一器件区域或第二器件区域中的另一个中形成p型导电性半导体器件，其中p型导电半导体器件包括具有p型功函数金属层。

Public/Granted literature

US20110269276A1 METHOD TO OPTIMIZE WORK FUNCTION IN COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) STRUCTURES Public/Granted day:2011-11-03

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8236	........增强型和耗尽型晶体管的组合