Invention Grant
- Patent Title: Semiconductor device having sealing film and manufacturing method thereof
- Patent Title (中): 具有密封膜的半导体装置及其制造方法
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Application No.: US12727406Application Date: 2010-03-19
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Publication No.: US08354349B2Publication Date: 2013-01-15
- Inventor: Junji Shiota
- Applicant: Junji Shiota
- Applicant Address: JP Tokyo
- Assignee: Casio Computer Co., Ltd.
- Current Assignee: Casio Computer Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2006-260349 20060926
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469
Abstract:
A semiconductor device includes a plurality of wiring lines which are provided on an upper side of a semiconductor substrate and which have connection pad portions, and columnar electrodes are provided on the connection pad portions of the wiring lines. A first sealing film is provided around the columnar electrodes on the upper side of the semiconductor substrate and on the wiring lines. A second sealing film is provided on the first sealing film. The first sealing film is made of a resin in which fillers are not mixed, and the second sealing film is made of a material in which fillers are mixed in a resin.
Public/Granted literature
- US20100173455A1 SEMICONDUCTOR DEVICE HAVING SEALING FILM AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-07-08
Information query
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