Invention Grant
- Patent Title: Multilayer wiring board and method for manufacturing the same
- Patent Title (中): 多层布线板及其制造方法
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Application No.: US13242043Application Date: 2011-09-23
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Publication No.: US08354596B2Publication Date: 2013-01-15
- Inventor: Michimasa Takahashi
- Applicant: Michimasa Takahashi
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/00 ; H05K3/36 ; H05K3/20 ; H05K3/10 ; H01R43/00
Abstract:
A wiring board including a main substrate including a base material and having an opening portion, and a flex-rigid printed wiring board connected to the main substrate in the opening portion of the main substrate and including a rigid substrate and a flexible substrate, the rigid substrate including a non-flexible base material, the flexible substrate including a flexible base material.
Public/Granted literature
- US20120012368A1 MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-01-19
Information query
