Invention Grant
US08354601B2 Method and structure for coaxial via routing in printed circuit boards for improved signal integrity 有权
用于印刷电路板中同轴通孔布线的方法和结构,用于改善信号完整性

  • Patent Title: Method and structure for coaxial via routing in printed circuit boards for improved signal integrity
  • Patent Title (中): 用于印刷电路板中同轴通孔布线的方法和结构,用于改善信号完整性
  • Application No.: US12798217
    Application Date: 2010-03-31
  • Publication No.: US08354601B2
    Publication Date: 2013-01-15
  • Inventor: James V. Russell
  • Applicant: James V. Russell
  • Agency: Law Office of Richard B Klar
  • Agent Richard B Klar, Esq.
  • Main IPC: H05K1/11
  • IPC: H05K1/11 H01K3/10
Method and structure for coaxial via routing in printed circuit boards for improved signal integrity
Abstract:
A method and a structure for a coaxial via that extend along the entire length of a signal via in a printed circuit board. Signal integrity is improved by providing ground shield for the entire length of the coaxial via. The ground shielding can be implemented by either providing ground cage vias around a signal via and routing a trace to the signal via on a built up layer or by providing a semi circle ground trench through a build up layer to permit a trace access to the signal via.
Information query
Patent Agency Ranking
0/0