Invention Grant
US08354687B1 Efficient thermal management and packaging for group III nitride based UV devices
有权
用于III族氮化物基UV设备的高效热管理和封装
- Patent Title: Efficient thermal management and packaging for group III nitride based UV devices
- Patent Title (中): 用于III族氮化物基UV设备的高效热管理和封装
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Application No.: US12512682Application Date: 2009-07-30
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Publication No.: US08354687B1Publication Date: 2013-01-15
- Inventor: Vinod Adivarahan , Asif Khan , Qhalid Fareed
- Applicant: Vinod Adivarahan , Asif Khan , Qhalid Fareed
- Applicant Address: US SC Irmo
- Assignee: Nitek, Inc.
- Current Assignee: Nitek, Inc.
- Current Assignee Address: US SC Irmo
- Agency: Nexsen Pruet, LLC
- Agent Joseph T. Guy
- Main IPC: H01L33/38
- IPC: H01L33/38

Abstract:
A high efficiency light emitting diode with an ultraviolet light-emitting structure. The structure has a first layer with a first conductivity comprising Al1-x-yInyGaxN wherein 0≦x≦1 and 0≦y≦1; a second layer with a second conductivity comprising Al1-x-yInyGaxN wherein 0≦x≦1 and 0≦y≦1; and a light emitting quantum well region between said first layer and said second layer comprising Al1-x-yInyGaxN wherein 0≦x≦1 and 0≦y≦1. The diode also has a carrier bonded to said first layer and said second layer wherein said carrier has a thermal conductivity of at least 100 W/mK and said carrier is resistive between a bonding location of said first layer and a second bonding location of said second layer.
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