Invention Grant
- Patent Title: Power MOSFET and its edge termination
- Patent Title (中): 功率MOSFET及其边缘端接
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Application No.: US12806203Application Date: 2010-01-11
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Publication No.: US08354711B2Publication Date: 2013-01-15
- Inventor: Jun Zeng , Mohamed N. Darwish , Richard A Blanchard
- Applicant: Jun Zeng , Mohamed N. Darwish , Richard A Blanchard
- Applicant Address: US CA Santa Clara
- Assignee: MaxPower Semiconductor, Inc.
- Current Assignee: MaxPower Semiconductor, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Groover & Associates, PLLC
- Agent Robert O. Groover, III; Gwendolyn S. S. Groover
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
Improved MOSFET structures and processes, where multiple polysilicon embedded regions are introduced into the n+ source contact area. A top poly Field Plate is used to shield the electric field from penetrating into the channel, so that a very short channel can be used without jeopardizing the device drain-source leakage current. A bottom poly Field Plate is used to modulate the electric field distribution in the drift region such that a more uniform field distribution can be obtained.
Public/Granted literature
- US20120043602A1 Power MOSFET and Its Edge Termination Public/Granted day:2012-02-23
Information query
IPC分类: