Invention Grant
- Patent Title: Electro-static discharge protection device, semiconductor device, and method for manufacturing electro-static discharge protection device
- Patent Title (中): 静电放电保护装置,半导体装置及静电放电保护装置的制造方法
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Application No.: US12034173Application Date: 2008-02-20
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Publication No.: US08354723B2Publication Date: 2013-01-15
- Inventor: Teruo Suzuki
- Applicant: Teruo Suzuki
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Fujitsu Patent Center
- Priority: JP2007-039703 20070220
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L21/336

Abstract:
An electrostatic discharge protection device including a gate electrode formed on a substrate. First and second diffusion regions of a first conductivity type are formed in the substrate with the gate electrode located in between. A first silicide layer is formed in the first diffusion region. A silicide block region is formed between the gate electrode and the first suicide layer. A third diffusion region is formed below the first silicide layer to partially overlap the first diffusion region. The third diffusion region and first silicide layer have substantially the same shapes and dimensions. The third diffusion region and a portion below the gate electrode located at the same depth as the third diffusion region contain impurities of a second conductivity type. The third diffusion region has an impurity concentration that is higher than that of the portion below the gate electrode.
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