Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12836826Application Date: 2010-07-15
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Publication No.: US08354728B2Publication Date: 2013-01-15
- Inventor: Masahiro Hayashi , Takahisa Akiba , Kunio Watanabe , Tomo Takaso , Susumu Kenmochi
- Applicant: Masahiro Hayashi , Takahisa Akiba , Kunio Watanabe , Tomo Takaso , Susumu Kenmochi
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2005-265483 20050913
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L29/788 ; H01L27/148 ; H01L29/768

Abstract:
A semiconductor device including: a semiconductor layer; a gate insulating layer; a gate electrode; a channel region; a source region and a drain region; a guard ring region; an offset insulating layer; a first interlayer dielectric; a first shield layer formed above the first interlayer dielectric and the guard ring region and electrically connected to the guard ring region; a second interlayer dielectric; and a second shield layer formed above the second interlayer dielectric, wherein the first shield layer is provided outside of both ends of the gate electrode in a channel width direction when viewed from the top side; and wherein the second shield layer is provided in at least part of a first region and/or at least part of a second region, the first region being a region between one edge of the gate electrode and an edge of the first shield layer opposite to the edge of the gate electrode in the channel width direction when viewed from the top side, and the second region being a region between the other edge of the gate electrode and an edge of the first shield layer opposite to the other edge of the gate electrode in the channel width direction when viewed from the top side.
Public/Granted literature
- US20100276762A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-11-04
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