Invention Grant
- Patent Title: Conductive polymer lid for a sensor package and method therefor
- Patent Title (中): 传感器封装用导电聚合物盖及其方法
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Application No.: US12791472Application Date: 2010-06-01
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Publication No.: US08354747B1Publication Date: 2013-01-15
- Inventor: Bob Shih-Wei Kuo
- Applicant: Bob Shih-Wei Kuo
- Applicant Address: US AZ Chandler
- Assignee: Amkor Technology, Inc
- Current Assignee: Amkor Technology, Inc
- Current Assignee Address: US AZ Chandler
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
A semiconductor device has a base substrate having a plurality of metal traces. A conductive polymer cover is provided having an opening. The conductive polymer cover forms a cavity when attached to the base substrate. At least one die is attached to an interior surface of the conductive polymer cover and positioned over the opening. The conductive polymer cover and the at least one die are electrically coupled to metal traces on the first surface of the base substrate.
Information query
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