Invention Grant
- Patent Title: In-package microelectronic apparatus, and methods of using same
- Patent Title (中): 包装内微电子装置及其使用方法
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Application No.: US13354708Application Date: 2012-01-20
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Publication No.: US08354748B2Publication Date: 2013-01-15
- Inventor: Sriram Dattaguru , Lesley A. Polka Wood , Yoshihiro Tomita , Kiniya Ichikawa , Robert L. Sankman
- Applicant: Sriram Dattaguru , Lesley A. Polka Wood , Yoshihiro Tomita , Kiniya Ichikawa , Robert L. Sankman
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent John N. Greaves
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/00 ; H05K1/18
Abstract:
A mounting substrate for a processor includes a die side and a land side with a processor footprint configured on the die side. The processor footprint is coupled to at least one processor interconnect and a microelectronic die is embedded in the mounting substrate. The microelectronic die is coupled to the processor interconnect and communication between a processor to be installed on the processor footprint is in a rate between 10 Gb/s and 1 Tb/s.
Public/Granted literature
- US20120113704A1 IN-PACKAGE MICROELECTRONIC APPARATUS, AND METHODS OF USING SAME Public/Granted day:2012-05-10
Information query
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