Invention Grant
US08354853B2 Test electronics to device under test interfaces, and methods and apparatus using same
有权
测试电子设备到被测设备的接口,以及使用它们的方法和设备
- Patent Title: Test electronics to device under test interfaces, and methods and apparatus using same
- Patent Title (中): 测试电子设备到被测设备的接口,以及使用它们的方法和设备
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Application No.: US12626506Application Date: 2009-11-25
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Publication No.: US08354853B2Publication Date: 2013-01-15
- Inventor: Sanjeev Grover , Donald W. Chiu , John W. Andberg
- Applicant: Sanjeev Grover , Donald W. Chiu , John W. Andberg
- Applicant Address: SG Singapore
- Assignee: Advantest (Singapore) Pte Ltd
- Current Assignee: Advantest (Singapore) Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: Holland & Hart LLP
- Main IPC: G01R31/00
- IPC: G01R31/00

Abstract:
In one embodiment, a test system has a set of test electronics for testing a device under test (DUT). The test system also has at least one test electronics to DUT interface having a zero insertion force (ZIF) connector. Each ZIF connector has a ZIF connector to DUT clamping mechanism configured to i) apply a first orthogonal force to a probe card that interfaces with a DUT, by pressing the ZIF connector against the probe card, and simultaneously ii) exert at least one second orthogonal force on the probe card, the at least one second orthogonal force being opposite in direction to the first orthogonal force.
Public/Granted literature
- US20100134134A1 TEST ELECTRONICS TO DEVICE UNDER TEST INTERFACES, AND METHODS AND APPARATUS USING SAME Public/Granted day:2010-06-03
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