Invention Grant
- Patent Title: Solid-state image capture device, manufacturing method therefor, and electronic apparatus
- Patent Title (中): 固体摄像装置及其制造方法以及电子装置
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Application No.: US12765455Application Date: 2010-04-22
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Publication No.: US08355072B2Publication Date: 2013-01-15
- Inventor: Akiko Ogino , Yukihiro Sayama , Takayuki Shoya , Masaya Shimoji , Yoshikazu Tanaka
- Applicant: Akiko Ogino , Yukihiro Sayama , Takayuki Shoya , Masaya Shimoji , Yoshikazu Tanaka
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2009-117401 20090514
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L31/062 ; H01L31/113 ; H01L21/02 ; H01L21/00

Abstract:
A solid-state image capture device includes: at least one photoelectric converter provided at an image capture surface of a substrate to receive incident light at a light-receiving surface of the photoelectric converter and photoelectrically convert the incident light to thereby generate signal charge; at least one on-chip lens provided at the image capture surface of the substrate and above the light-receiving surface of the photoelectric converter to focus the incident light onto the light-receiving surface; and an antireflection layer provided on an upper surface of the on-chip lens at the image capture surface of the substrate. The antireflection layer contains a binder resin having a lower refractive index than the on-chip lens and low-refractive-index particles having a lower refractive index than the binder resin.
Public/Granted literature
- US20100289939A1 SOLID-STATE IMAGE CAPTURE DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS Public/Granted day:2010-11-18
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