- Patent Title: Exposure apparatus, exposure method and device manufacturing method
-
Application No.: US12314571Application Date: 2008-12-12
-
Publication No.: US08355113B2Publication Date: 2013-01-15
- Inventor: Shinichi Okita
- Applicant: Shinichi Okita
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-325222 20071217
- Main IPC: G03B27/42
- IPC: G03B27/42 ; G03B27/58 ; G03B27/62

Abstract:
An exposure apparatus restricts reduction in throughput. The exposure apparatus controls movement such that, (1) when a substrate is moving in one direction, a first pattern is moved in a specified direction to expose a first shot region using a first exposure light, then movement of the substrate in the one direction continues while moving the second pattern in the specified direction to expose a second shot region, and (2) then the respective movement directions of the substrate and the second pattern are reversed to expose a third shot region using the second exposure light, then movement of the substrate in the reverse direction continues while moving the first pattern in a direction that is the reverse of the specified direction to expose a fourth shot region using the first exposure light.
Public/Granted literature
- US20090153819A1 Exposure apparatus, exposure method and device manufacturing method Public/Granted day:2009-06-18
Information query