Invention Grant
- Patent Title: Defect inspection apparatus and its method
- Patent Title (中): 缺陷检查装置及其方法
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Application No.: US13368585Application Date: 2012-02-08
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Publication No.: US08355123B2Publication Date: 2013-01-15
- Inventor: Akira Hamamatsu , Hisae Shibuya , Shunji Maeda
- Applicant: Akira Hamamatsu , Hisae Shibuya , Shunji Maeda
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2007-190300 20070723
- Main IPC: G01N21/88
- IPC: G01N21/88

Abstract:
A defect inspection apparatus for inspecting defects on an inspecting object includes an illuminator which irradiates a beam of light on the inspecting object, a photo-detector which detects rays of light from the inspecting object due to the irradiation of the light beam by the illuminator, a defect detector which detects a defect by processing a signal obtained through detection by the photo-detector, a characteristic quantity calculator which calculates a characteristic quantity related to a size of the defect, and a defect size calculator which uses a relation between size and characteristic quantity which is calculated by an optical simulation and calculates a size of the detected defect.
Public/Granted literature
- US20120133927A1 DEFECT INSPECTION APPARATUS AND ITS METHOD Public/Granted day:2012-05-31
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