Invention Grant
- Patent Title: Method and apparatus for reviewing defects
- Patent Title (中): 检查缺陷的方法和装置
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Application No.: US12428557Application Date: 2009-04-23
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Publication No.: US08355559B2Publication Date: 2013-01-15
- Inventor: Minoru Harada , Ryo Nakagaki , Kenji Obara , Atsushi Miyamoto
- Applicant: Minoru Harada , Ryo Nakagaki , Kenji Obara , Atsushi Miyamoto
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2008-112515 20080423; JP2009-098812 20090415
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method.
Public/Granted literature
- US20090268959A1 METHOD AND APPARATUS FOR REVIEWING DEFECTS Public/Granted day:2009-10-29
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