Invention Grant
US08356269B2 Dummy-metal-layout evaluating device and dummy-metal-layout evaluating method 有权
虚拟金属布局评估装置和虚拟金属布局评估方法

  • Patent Title: Dummy-metal-layout evaluating device and dummy-metal-layout evaluating method
  • Patent Title (中): 虚拟金属布局评估装置和虚拟金属布局评估方法
  • Application No.: US13112192
    Application Date: 2011-05-20
  • Publication No.: US08356269B2
    Publication Date: 2013-01-15
  • Inventor: Daisuke Fukuda
  • Applicant: Daisuke Fukuda
  • Applicant Address: JP Kawasaki
  • Assignee: Fujitsu Limited
  • Current Assignee: Fujitsu Limited
  • Current Assignee Address: JP Kawasaki
  • Agency: Fujitsu Patent Center
  • Priority: JP2010-184403 20100819
  • Main IPC: G06F17/50
  • IPC: G06F17/50
Dummy-metal-layout evaluating device and dummy-metal-layout evaluating method
Abstract:
A dummy-mesh-information creating unit separates a group of dummy metal blocks that are arranged in a pattern regularly staggered with respect to a direction of a wire object into meshes so that each mesh has the same layout of dummy metal blocks. An overlap determining unit determines whether a dummy metal block within a dummy mesh overlaps with the wire object. A dummy-information calculating unit calculates dummy information after any dummy metal block that is determined to be overlapped with the wire object is removed. An information integrating unit integrates the dummy information with information about the wire object, thereby generating a dummy-fill circuit layout. An evaluating unit evaluates whether the dummy-fill circuit layout satisfies the design criteria.
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