A method of producing a multilayer printed wiring board by attaching a photosensitive dry film onto an interlaminar resin insulating layer having a thin-film conductor layer and conducting a light exposure and development to form a plating resist and then forming a conductor circuit on a portion not forming the plating resist, characterized in that the photosensitive dry film has a nitrogen-containing heterocyclic compound layer on its either surface.A photosensitive dry film capable of improving the compatibility between thin-film conductor layer and photosensitive dry film to strengthen the adhesion force and to prevent the occurrence of floating or the like in the photosensitive dry film as well as a method of producing a multilayer printed wiring board using such a dry film.