Invention Grant
- Patent Title: Method of releasing high temperature films and/or devices from metallic substrates
- Patent Title (中): 从金属基板释放高温膜和/或器件的方法
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Application No.: US11991831Application Date: 2006-08-30
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Publication No.: US08356407B2Publication Date: 2013-01-22
- Inventor: Nicole Anderson , Dimitris Elias Katsoulis , Bizhong Zhu
- Applicant: Nicole Anderson , Dimitris Elias Katsoulis , Bizhong Zhu
- Applicant Address: US MI Midland
- Assignee: Dow Corning Corporation
- Current Assignee: Dow Corning Corporation
- Current Assignee Address: US MI Midland
- Agent Larry A. Milco
- International Application: PCT/US2006/033548 WO 20060830
- International Announcement: WO2007/040870 WO 20070412
- Main IPC: C08J5/18
- IPC: C08J5/18 ; B32B27/00 ; C09D183/04 ; B29C41/00
Abstract:
Films and electronic devices can be released from metallic substrates by: (i) applying a coating of a polysilsesquioxane resin to a metallic substrate, (ii) heating the coated metallic substrate to a temperature sufficient to cure the polysilsesquioxane resin, (iii) applying a polymeric film to the cured coating on the metallic substrate, (iv) further heating the coated metallic substrate to a temperature sufficient to cure the polymeric film, (v) optionally fabricating electronic devices on the polymeric film, and (vi) releasing the polymeric film from the metallic substrate.
Public/Granted literature
- US20090098393A1 Method of Releasing High Temperature Films and/or Devices from Metallic Substrates Public/Granted day:2009-04-16
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