Invention Grant
- Patent Title: Hydrophilic porous substrates
- Patent Title (中): 亲水多孔基材
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Application No.: US12678297Application Date: 2008-10-08
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Publication No.: US08356717B2Publication Date: 2013-01-22
- Inventor: Clinton P. Waller, Jr. , Douglas E. Weiss
- Applicant: Clinton P. Waller, Jr. , Douglas E. Weiss
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Kent S. Kokko
- International Application: PCT/US2008/079176 WO 20081008
- International Announcement: WO2009/048933 WO 20090416
- Main IPC: B01D71/78
- IPC: B01D71/78 ; B01D71/82 ; B01D71/44
Abstract:
Hydrophilic porous substrates, methods of making hydrophilic porous substrates from hydrophobic polymers are disclosed.
Public/Granted literature
- US20100206806A1 HYDROPHILIC POROUS SUBSTRATES Public/Granted day:2010-08-19
Information query
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