Invention Grant
- Patent Title: Wet-processing apparatus
- Patent Title (中): 湿处理设备
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Application No.: US13105040Application Date: 2011-05-11
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Publication No.: US08356951B2Publication Date: 2013-01-22
- Inventor: Yasuaki Noda , Akira Fukutomi , Takafumi Hayama
- Applicant: Yasuaki Noda , Akira Fukutomi , Takafumi Hayama
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown
- Priority: JP2010-116905 20100521; JP2011-027020 20110210
- Main IPC: G03D5/00
- IPC: G03D5/00

Abstract:
A wet-processing apparatus, which spouts a coating liquid onto a surface of a substrate, includes: nozzles provided with passages for the coating liquid; a light source which illuminates an area between a plane containing the tips of the nozzles and the surface of the substrate; a camera for forming an image of the area; a control unit which provides a spout signal requesting spouting the liquid from the nozzle toward the substrate, and an imaging signal requesting the camera to start an imaging operation; and a decision unit which decides whether or not the liquid was spouted from the nozzle and whether or not changes occurred in the condition of the liquid spouted from the nozzle toward the substrate on the basis of an image formed by the camera and expressing the brightness of the liquid spouted toward the substrate and illuminated by light emitted by the light source.
Public/Granted literature
- US20110286738A1 WET-PROCESSING APPARATUS Public/Granted day:2011-11-24
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