Invention Grant
- Patent Title: Machining apparatus and machining method
- Patent Title (中): 加工设备及加工方法
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Application No.: US12590198Application Date: 2009-11-04
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Publication No.: US08356961B2Publication Date: 2013-01-22
- Inventor: Norishige Kumagai , Tamio Otani , Katsuhiro Nagasawa , Jun Wakamatsu , Hiroyuki Kamata , Tomoaki Ozaki
- Applicant: Norishige Kumagai , Tamio Otani , Katsuhiro Nagasawa , Jun Wakamatsu , Hiroyuki Kamata , Tomoaki Ozaki
- Applicant Address: JP Kanagawa
- Assignee: Hitachi Via Mechanics Ltd.
- Current Assignee: Hitachi Via Mechanics Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Jordan and Hamburg LLP
- Priority: JP2008-284648 20081105; JP2009-202064 20090901
- Main IPC: B23B41/00
- IPC: B23B41/00

Abstract:
The invention provides a machining apparatus, and its machining method, having machining tables whose weight do not increase so much even if a number of machining sections such as spindles is increased. One of the machining tables is a rectangular stationary table having a groove in the direction perpendicular to the longitudinal direction on its surface and the other is a rectangular movable table engaged with the groove. The machining apparatus machines a printed circuit board, whose area is larger than that of the movable table, on a mounting surface of the stationary table by changing position of the printed circuit board by moving the movable table and by determining machining position by moving a spindle at position facing the mounting surface of the stationary table.
Public/Granted literature
- US20100119317A1 Machining apparatus and machining method Public/Granted day:2010-05-13
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