Invention Grant
- Patent Title: Polishing pad and method of manufacture
- Patent Title (中): 抛光垫及其制造方法
-
Application No.: US11494050Application Date: 2006-07-27
-
Publication No.: US08357027B2Publication Date: 2013-01-22
- Inventor: Alan H. Saikin
- Applicant: Alan H. Saikin
- Applicant Address: US DE Newark
- Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee Address: US DE Newark
- Agent Blake T. Biederman
- Main IPC: B24B7/22
- IPC: B24B7/22
Abstract:
The present invention relates to a method of manufacturing a polishing pad with embedded polymeric capsules useful for planarizing a substrate in a CMP process using a polishing composition. The method reduces non-uniformity of the polishing pad due to capsule floating, differential heating and capsule expansion by the use of novel capsule materials. The method also increases the efficiency of the manufacturing process by reducing the number of defective products and reducing waste.
Public/Granted literature
- US20070042693A1 Polishing pad and method of manufacture Public/Granted day:2007-02-22
Information query
