Invention Grant
- Patent Title: Method for the purification of copper chloride solution
- Patent Title (中): 氯化铜溶液纯化方法
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Application No.: US10511290Application Date: 2003-04-15
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Publication No.: US08357227B2Publication Date: 2013-01-22
- Inventor: Raimo Leimala
- Applicant: Raimo Leimala
- Applicant Address: FI Espoo
- Assignee: Outotec Oyj
- Current Assignee: Outotec Oyj
- Current Assignee Address: FI Espoo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: FI20020749 20020419
- International Application: PCT/FI03/00292 WO 20030415
- International Announcement: WO03/089675 WO 20031030
- Main IPC: C22B15/00
- IPC: C22B15/00
Abstract:
The invention relates to a method for the removal of metal impurities in chloride-based copper recovery processes. The amount of impurities in a strong chloride solution of monovalent copper can be reduced according to the method down to very low levels by using ion exchange as at least one purification stage.
Public/Granted literature
- US20050145073A1 Method for the purification of copper chloride solution Public/Granted day:2005-07-07
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