Invention Grant
US08357259B2 Method for assembling at least two plates and use of the method for preparing an ion beam sputtering assembly
有权
用于组装至少两个板的方法和使用用于制备离子束溅射组件的方法
- Patent Title: Method for assembling at least two plates and use of the method for preparing an ion beam sputtering assembly
- Patent Title (中): 用于组装至少两个板的方法和使用用于制备离子束溅射组件的方法
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Application No.: US12529581Application Date: 2008-03-03
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Publication No.: US08357259B2Publication Date: 2013-01-22
- Inventor: Michel Martin , Philippe Maurin-Perrier , Christophe Heau , Olivier Blandenet
- Applicant: Michel Martin , Philippe Maurin-Perrier , Christophe Heau , Olivier Blandenet
- Applicant Address: FR Andrezieux Boutheon
- Assignee: H.E.F.
- Current Assignee: H.E.F.
- Current Assignee Address: FR Andrezieux Boutheon
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Priority: FR0753648 20070305
- International Application: PCT/FR2008/050358 WO 20080303
- International Announcement: WO2008/122738 WO 20081016
- Main IPC: B32B7/14
- IPC: B32B7/14 ; B32B37/00 ; B29C65/00 ; B29C65/48 ; C23C14/00 ; C25B11/00 ; C25B13/00
Abstract:
According to the method, drops of an adhesive material are deposited on one of the plates, with the drops being spaced from one another. A grid having a predefined thickness lower than that of the drops is applied to the plate receiving the drops. A perpendicular and uniform pressure is applied to at least one of the plates, so that the drops spread and come into contact with the opposing sides of the two plates. The spacing of the drops is defined so that after spreading under the pressure applied, air is not trapped between the drops.
Public/Granted literature
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