Invention Grant
- Patent Title: Polyamide-polyphenylene ether resin composition and film
- Patent Title (中): 聚酰胺 - 聚苯醚树脂组合物和膜
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Application No.: US12601582Application Date: 2008-06-03
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Publication No.: US08357450B2Publication Date: 2013-01-22
- Inventor: Takaaki Miyoshi , Hiroaki Furukawa
- Applicant: Takaaki Miyoshi , Hiroaki Furukawa
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2007-148531 20070604
- International Application: PCT/JP2008/060227 WO 20080603
- International Announcement: WO2008/149862 WO 20081211
- Main IPC: C08G69/26
- IPC: C08G69/26 ; C08K3/04 ; C08L71/12 ; C08L77/00
Abstract:
The present invention provides a polyamide-polyphenylene ether resin composition comprising a polyamide having an alicyclic structure and composed of dicarboxylic acid units comprising from 20 to 100 mol % of cyclohexanedicarboxylic acid units and diamine units comprising aliphatic diamine units with from 6 to 12 carbon atoms, a polyphenylene ether, and a compatibilizer for a polyamide and a polyphenylene ether.
Public/Granted literature
- US20100173139A1 POLYAMIDE-POLYPHENYLENE ETHER RESIN COMPOSITION AND FILM Public/Granted day:2010-07-08
Information query
