Invention Grant
- Patent Title: Humidity-reactive hotmelt adhesive with increased open time
- Patent Title (中): 湿热反应热熔胶具有增加的开放时间
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Application No.: US12226351Application Date: 2007-06-29
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Publication No.: US08357453B2Publication Date: 2013-01-22
- Inventor: Ukiwo Onuoha
- Applicant: Ukiwo Onuoha
- Applicant Address: CH Baar
- Assignee: Sika Technology AG
- Current Assignee: Sika Technology AG
- Current Assignee Address: CH Baar
- Agency: Oliff & Berridge, PLC
- Priority: EP06116413 20060630
- International Application: PCT/EP2007/056600 WO 20070629
- International Announcement: WO2008/000832 WO 20080103
- Main IPC: B32B27/40
- IPC: B32B27/40 ; C08L75/04 ; C09D175/04

Abstract:
The invention relates to moisture-reactive hotmelt adhesive compositions which comprise at least one polyurethane prepolymer P1 being liquid at room temperature containing isocyanate groups and also at least one linear polyurethane P2 being solid at room temperature which comprises polycaprolactone segments, contains hydroxyl groups and has a melt viscosity of 100-300 Pa·s at 170° C. The compositions are notable in particular for a prolonged open time.
Public/Granted literature
- US20090110937A1 Humidity-Reactive Hotmelt Adhesive with Increased Open Time Public/Granted day:2009-04-30
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