Invention Grant
US08357453B2 Humidity-reactive hotmelt adhesive with increased open time 失效
湿热反应热熔胶具有增加的开放时间

  • Patent Title: Humidity-reactive hotmelt adhesive with increased open time
  • Patent Title (中): 湿热反应热熔胶具有增加的开放时间
  • Application No.: US12226351
    Application Date: 2007-06-29
  • Publication No.: US08357453B2
    Publication Date: 2013-01-22
  • Inventor: Ukiwo Onuoha
  • Applicant: Ukiwo Onuoha
  • Applicant Address: CH Baar
  • Assignee: Sika Technology AG
  • Current Assignee: Sika Technology AG
  • Current Assignee Address: CH Baar
  • Agency: Oliff & Berridge, PLC
  • Priority: EP06116413 20060630
  • International Application: PCT/EP2007/056600 WO 20070629
  • International Announcement: WO2008/000832 WO 20080103
  • Main IPC: B32B27/40
  • IPC: B32B27/40 C08L75/04 C09D175/04
Humidity-reactive hotmelt adhesive with increased open time
Abstract:
The invention relates to moisture-reactive hotmelt adhesive compositions which comprise at least one polyurethane prepolymer P1 being liquid at room temperature containing isocyanate groups and also at least one linear polyurethane P2 being solid at room temperature which comprises polycaprolactone segments, contains hydroxyl groups and has a melt viscosity of 100-300 Pa·s at 170° C. The compositions are notable in particular for a prolonged open time.
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