Invention Grant
US08357563B2 Stitch bump stacking design for overall package size reduction for multiple stack
有权
针对堆叠堆叠设计，针对多个堆叠的整体封装尺寸缩小
- Patent Title: Stitch bump stacking design for overall package size reduction for multiple stack
- Patent Title (中): 针对堆叠堆叠设计，针对多个堆叠的整体封装尺寸缩小
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Application No.: US12853856Application Date: 2010-08-10
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Publication No.: US08357563B2Publication Date: 2013-01-22
- Inventor: Lai Nguk Chin , Foong Yue Ho , Wong Kwet Nam , Koo Eng Luon , Sally Foong , Kevin Guan
- Applicant: Lai Nguk Chin , Foong Yue Ho , Wong Kwet Nam , Koo Eng Luon , Sally Foong , Kevin Guan
- Applicant Address: US CA Sunnyvale
- Assignee: Spansion LLC
- Current Assignee: Spansion LLC
- Current Assignee Address: US CA Sunnyvale
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for die stacking is disclosed. In one embodiment a first die is formed overlying a substrate. A first wire is bonded to the first die and to a bond finger of the substrate, wherein the first wire is bonded to the bond finger with a first bond. A first stitch bump is formed overlying the first stitch bond, wherein the first stitch bump is formed from a molten ball of conductive material. A second die is formed overlying the first die. A second wire is bonded to the second die and to the first stitch bump, wherein the second wire is bonded to the first stitch bump with a second bond.
Public/Granted literature
- US20120038059A1 STITCH BUMP STACKING DESIGN FOR OVERALL PACKAGE SIZE REDUCTION FOR MULTIPLE STACK Public/Granted day:2012-02-16
Information query
IPC分类:
