Invention Grant
US08357566B2 Pre-encapsulated lead frames for microelectronic device packages, and associated methods
有权
用于微电子器件封装的预封装引线框架及相关方法
- Patent Title: Pre-encapsulated lead frames for microelectronic device packages, and associated methods
- Patent Title (中): 用于微电子器件封装的预封装引线框架及相关方法
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Application No.: US11510026Application Date: 2006-08-25
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Publication No.: US08357566B2Publication Date: 2013-01-22
- Inventor: Ai-Chie Wang , Choon Kuan Lee , Chin Hui Chong , Wuu Yean Tay
- Applicant: Ai-Chie Wang , Choon Kuan Lee , Chin Hui Chong , Wuu Yean Tay
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Pre-encapsulated lead frames suitable for use in microelectronic device packages are disclosed. Individual lead frames can include a set of multiple lead fingers arranged side by side with neighboring lead fingers spaced apart from each other by a corresponding gap. An encapsulating compound at least partially encapsulates the set of lead fingers without encapsulating a microelectronic device. The encapsulating compound can generally fill the plurality of gaps between two adjacent lead fingers.
Public/Granted literature
- US20080048301A1 Pre-encapsulated lead frames for microelectronic device packages, and associated methods Public/Granted day:2008-02-28
Information query
IPC分类:
