Invention Grant
- Patent Title: Method of fabricating finfet device
- Patent Title (中): finfet装置的制作方法
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Application No.: US12569689Application Date: 2009-09-29
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Publication No.: US08357569B2Publication Date: 2013-01-22
- Inventor: Bartlomiej Jan Pawlak
- Applicant: Bartlomiej Jan Pawlak
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
The present disclosure provides a FinFET device and method of fabricating a FinFET device. The method includes providing a substrate, forming a fin structure on the substrate, forming a gate structure including a gate dielectric and gate electrode, the gate structure overlying a portion of the fin structure, forming a protection layer over another portion of the fin structure, and thereafter performing an implantation process to form source and drain regions.
Public/Granted literature
- US20110073919A1 METHOD OF FABRICATING FINFET DEVICE Public/Granted day:2011-03-31
Information query
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