Invention Grant
- Patent Title: Semiconductor substrate with solid phase epitaxial regrowth with reduced depth of doping profile and method of producing same
- Patent Title (中): 具有固相外延再生长的半导体衬底,掺杂分布深度降低,生产方法
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Application No.: US10596603Application Date: 2004-12-10
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Publication No.: US08357595B2Publication Date: 2013-01-22
- Inventor: Bartlomiej J. Pawlak
- Applicant: Bartlomiej J. Pawlak
- Applicant Address: BE Leuven
- Assignee: IMEC
- Current Assignee: IMEC
- Current Assignee Address: BE Leuven
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: EP03104871 20031222
- International Application: PCT/IB2004/052753 WO 20041210
- International Announcement: WO2005/064662 WO 20050714
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
Method of producing a semiconductor device, comprising: a) providing a semiconductor substrate, b) providing an insulating layer on a top surface of the semiconductor substrate, c) making an amorphous layer in a top layer of said semiconductor substrate by a suitable implant, d) implanting a dopant into said semiconductor substrate through said insulating layer to provide said amorphous layer with a predetermined doping profile, said implant being performed such that said doping profile has a peak value located within said insulating layer, e) applying a solid phase epitaxial regrowth action to regrow said amorphous layer and activate said dopant.
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