Invention Grant
US08357595B2 Semiconductor substrate with solid phase epitaxial regrowth with reduced depth of doping profile and method of producing same 有权
具有固相外延再生长的半导体衬底,掺杂分布深度降低,生产方法

  • Patent Title: Semiconductor substrate with solid phase epitaxial regrowth with reduced depth of doping profile and method of producing same
  • Patent Title (中): 具有固相外延再生长的半导体衬底,掺杂分布深度降低,生产方法
  • Application No.: US10596603
    Application Date: 2004-12-10
  • Publication No.: US08357595B2
    Publication Date: 2013-01-22
  • Inventor: Bartlomiej J. Pawlak
  • Applicant: Bartlomiej J. Pawlak
  • Applicant Address: BE Leuven
  • Assignee: IMEC
  • Current Assignee: IMEC
  • Current Assignee Address: BE Leuven
  • Agency: Knobbe, Martens, Olson & Bear LLP
  • Priority: EP03104871 20031222
  • International Application: PCT/IB2004/052753 WO 20041210
  • International Announcement: WO2005/064662 WO 20050714
  • Main IPC: H01L21/20
  • IPC: H01L21/20
Semiconductor substrate with solid phase epitaxial regrowth with reduced depth of doping profile and method of producing same
Abstract:
Method of producing a semiconductor device, comprising: a) providing a semiconductor substrate, b) providing an insulating layer on a top surface of the semiconductor substrate, c) making an amorphous layer in a top layer of said semiconductor substrate by a suitable implant, d) implanting a dopant into said semiconductor substrate through said insulating layer to provide said amorphous layer with a predetermined doping profile, said implant being performed such that said doping profile has a peak value located within said insulating layer, e) applying a solid phase epitaxial regrowth action to regrow said amorphous layer and activate said dopant.
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