Invention Grant
- Patent Title: High affinity Siglec ligands
- Patent Title (中): 高亲和力Siglec配体
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Application No.: US12084723Application Date: 2006-11-10
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Publication No.: US08357671B2Publication Date: 2013-01-22
- Inventor: James Paulson , Brian Collins , Shoufa Han
- Applicant: James Paulson , Brian Collins , Shoufa Han
- Applicant Address: US CA Del Mar
- Assignee: James Paulson
- Current Assignee: James Paulson
- Current Assignee Address: US CA Del Mar
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2006/043661 WO 20061110
- International Announcement: WO2007/056525 WO 20070518
- Main IPC: A01N43/04
- IPC: A01N43/04 ; A61K31/715 ; C13K5/00 ; C13K7/00
Abstract:
The invention relates to high affinity Siglec ligands that are useful for isolating cells that express Siglecs and for delivering agents to cells that express Siglecs. In one embodiment, the invention provides a method for treating cancer in a mammal that involves administering a Siglec ligand of the invention to the mammal, where the Siglec ligand is linked to a therapeutic agent.
Public/Granted literature
- US20090238837A1 High Affinity Siglec Ligands Public/Granted day:2009-09-24
Information query
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