Peroxide curable fluoroelastomer compositions and articles made therefrom are disclosed. The compositions contain 5 to 45 weight percent, based on total weight of all fluoroelastomers present in the composition, of a blend of dynamically cured fluoroelastomer particles in an uncured fluoroelastomer. The compositions are unfilled, but have tensile properties adequate for many end use applications and are particularly useful as seals in semiconductor manufacturing equipment.