An adhesion promoter for a hot melt adhesive or a pressure sensitive adhesive prepared by admixing a silane composition with an aqueous buffer solution, where the silane composition includes at least two silane compounds. The adhesive is able to bind at very low surface free energy substrates, such as Xerographic prints contaminated by silicone fuser oil. The hot melt adhesive maintains a substantially stable viscosity at temperature ranging from about 100° C. to about 200° C.