Invention Grant
US08357815B2 Metal compound, material for chemical vapor phase growth, and process for forming metal-containing thin film 有权
金属化合物,用于化学气相生长的材料,以及用于形成含金属薄膜的工艺

  • Patent Title: Metal compound, material for chemical vapor phase growth, and process for forming metal-containing thin film
  • Patent Title (中): 金属化合物,用于化学气相生长的材料,以及用于形成含金属薄膜的工艺
  • Application No.: US12740188
    Application Date: 2008-10-22
  • Publication No.: US08357815B2
    Publication Date: 2013-01-22
  • Inventor: Naoki YamadaAtsuya YoshinakaSenji Wada
  • Applicant: Naoki YamadaAtsuya YoshinakaSenji Wada
  • Applicant Address: JP Tokyo
  • Assignee: Adeka Corporation
  • Current Assignee: Adeka Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Young & Thompson
  • Priority: JP2008-014791 20080125
  • International Application: PCT/JP2008/069121 WO 20081022
  • International Announcement: WO2009/093366 WO 20090730
  • Main IPC: C07F7/00
  • IPC: C07F7/00 C23C16/00
Metal compound, material for chemical vapor phase growth, and process for forming metal-containing thin film
Abstract:
A novel metal compound of general formula (1), a material for chemical vapor phase growth containing the compound, and a process for forming a metal-containing thin film by chemical vapor phase growth using the material. Among the compounds of formula (1), those wherein X is a chlorine atom are preferred because of inexpensiveness and high volatility. When M is titanium, those wherein m is 1 are preferred as having a greater difference between a volatilization temperature (vapor temperature) and a deposition temperature (reaction temperature), which provides a broader process margin. In formula (1), M is titanium, zirconium, or hafnium; X is a halogen atom; and m is 1 or 2.
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