Invention Grant
US08357815B2 Metal compound, material for chemical vapor phase growth, and process for forming metal-containing thin film
有权
金属化合物,用于化学气相生长的材料,以及用于形成含金属薄膜的工艺
- Patent Title: Metal compound, material for chemical vapor phase growth, and process for forming metal-containing thin film
- Patent Title (中): 金属化合物,用于化学气相生长的材料,以及用于形成含金属薄膜的工艺
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Application No.: US12740188Application Date: 2008-10-22
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Publication No.: US08357815B2Publication Date: 2013-01-22
- Inventor: Naoki Yamada , Atsuya Yoshinaka , Senji Wada
- Applicant: Naoki Yamada , Atsuya Yoshinaka , Senji Wada
- Applicant Address: JP Tokyo
- Assignee: Adeka Corporation
- Current Assignee: Adeka Corporation
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2008-014791 20080125
- International Application: PCT/JP2008/069121 WO 20081022
- International Announcement: WO2009/093366 WO 20090730
- Main IPC: C07F7/00
- IPC: C07F7/00 ; C23C16/00

Abstract:
A novel metal compound of general formula (1), a material for chemical vapor phase growth containing the compound, and a process for forming a metal-containing thin film by chemical vapor phase growth using the material. Among the compounds of formula (1), those wherein X is a chlorine atom are preferred because of inexpensiveness and high volatility. When M is titanium, those wherein m is 1 are preferred as having a greater difference between a volatilization temperature (vapor temperature) and a deposition temperature (reaction temperature), which provides a broader process margin. In formula (1), M is titanium, zirconium, or hafnium; X is a halogen atom; and m is 1 or 2.
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