Invention Grant
US08357859B2 Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate
失效
绝缘树脂板层压板和包括绝缘树脂板层压板的多层印刷电路板
- Patent Title: Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate
- Patent Title (中): 绝缘树脂板层压板和包括绝缘树脂板层压板的多层印刷电路板
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Application No.: US12523127Application Date: 2008-01-16
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Publication No.: US08357859B2Publication Date: 2013-01-22
- Inventor: Hiroaki Wakabayashi , Noriyuki Ohigashi
- Applicant: Hiroaki Wakabayashi , Noriyuki Ohigashi
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-006615 20070116
- International Application: PCT/JP2008/050429 WO 20080116
- International Announcement: WO2008/087972 WO 20080724
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
Disclosed is an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) including an insulating resin layer with a uniform thickness that is formed without repulsion or unevenness in a process of forming the insulating resin layer on a film or a metal foil, and a multi-layer printed circuit board that includes the insulating resin sheet laminate and possesses high insulating reliability. The present invention provides an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) obtained by forming an insulating resin layer made of a resin composition on a film or a metal foil, and the resin composition includes an acrylic surfactant.
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