Invention Grant
- Patent Title: Wiring board having a connecting pad area which is smaller than a surface plating layer area
- Patent Title (中): 接线板，其具有小于表面镀层区域的连接焊盘区域
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Application No.: US12126329Application Date: 2008-05-23
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Publication No.: US08357860B2Publication Date: 2013-01-22
- Inventor: Kentaro Kaneko
- Applicant: Kentaro Kaneko
- Applicant Address: JP Nagano-shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2007-143340 20070530
- Main IPC: H05K7/02
- IPC: H05K7/02
Abstract:
A wiring board has predetermined numbers of wiring layers and insulating layers among the respective wiring layers. The wiring board has an external connecting pad and a surface plating layer for connecting to an external circuit is arranged on the external connecting pad. An area of an external connecting pad is smaller than an area of a surface plating layer thereof.
Public/Granted literature
- US20080298038A1 WIRING BOARD AND ITS FABRICATING METHOD Public/Granted day:2008-12-04
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