Invention Grant
US08357901B2 Infrared sensors, focal plane arrays and thermal imaging systems with temperature compensation
有权
红外传感器,焦平面阵列和具有温度补偿的热成像系统
- Patent Title: Infrared sensors, focal plane arrays and thermal imaging systems with temperature compensation
- Patent Title (中): 红外传感器,焦平面阵列和具有温度补偿的热成像系统
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Application No.: US13370157Application Date: 2012-02-09
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Publication No.: US08357901B2Publication Date: 2013-01-22
- Inventor: Chongfei Shen
- Applicant: Chongfei Shen
- Applicant Address: CN Shanghai
- Assignee: Shanghai Juge Electronics Technologies Co. Ltd.
- Current Assignee: Shanghai Juge Electronics Technologies Co. Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Huanyong Gao;Sheppard, Mullin, Richter & Hampton LLP
- Main IPC: G01J5/52
- IPC: G01J5/52

Abstract:
An infrared sensor and infrared imaging system, wherein said infrared sensor comprises: a first film structure, a second film structure, a gap between said first film structure and said second film structure. Reference light is incident from one of said first film structure and said second film structure. When said gap distance changes, the intensity of transmitted reference light changes, and the intensity of reflected reference light changes. When infrared light is incident, at least one of the said first and second film structures absorbs infrared light and the temperature changes, causing said gap distance to change. By detecting the intensity of said transmitted reference light or reflected reference light, the incident infrared light can be measured. An infrared sensor and infrared imaging system also include a temperature compensation mechanism, and are insensitive to the fluctuations of the environmental temperature.
Public/Granted literature
- US20120138797A1 INFRARED SENSORS, FOCAL PLANE ARRAYS AND THERMAL IMAGING SYSTEMS Public/Granted day:2012-06-07
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