Invention Grant
- Patent Title: Electronic component, and a method of manufacturing an electronic component
- Patent Title (中): 电子部件，以及电子部件的制造方法
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Application No.: US12594739Application Date: 2008-04-17
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Publication No.: US08357920B2Publication Date: 2013-01-22
- Inventor: Friso Jacobus Jedema
- Applicant: Friso Jacobus Jedema
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP07106576 20070420
- International Application: PCT/IB2008/051483 WO 20080417
- International Announcement: WO2008/129480 WO 20081030
- Main IPC: H01L47/00
- IPC: H01L47/00
Abstract:
An electronic component (100) comprising a matrix (102) and a plurality of islands (103) embedded in the matrix (102) and comprising a material which is convertible between at least two states characterized by different electrical properties, wherein the plurality of islands (103) form a continuous path (104) in the matrix (102).
Public/Granted literature
- US20100044665A1 ELECTRONIC COMPONENT, AND A METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT Public/Granted day:2010-02-25
Information query
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