Invention Grant
- Patent Title: Package for light emitting device and method for packaging the same
- Patent Title (中): 用于发光器件的封装及其封装方法
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Application No.: US12784273Application Date: 2010-05-20
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Publication No.: US08357947B2Publication Date: 2013-01-22
- Inventor: Jun Seok Park
- Applicant: Jun Seok Park
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2004-0107783 20041217
- Main IPC: H01L29/22
- IPC: H01L29/22
Abstract:
There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increase.
Public/Granted literature
- US20100220474A1 PACKAGE FOR LIGHT EMITTING DEVICE AND METHOD FOR PACKAGING THE SAME Public/Granted day:2010-09-02
Information query
IPC分类:
