An LED (light emitting diode) chip includes a substrate, a first conduction layer formed on a top surface of the substrate, and a second conduction layer formed on the first conduction layer. The first conduction layer extends from a bottom surface of the second conduction layer to a circumferential surface of the second conduction layer, thereby surrounding the bottom surface and the circumferential surface of the second conduction layer. An active layer is sandwiched between the first and second conduction layers, to increase a contact area between the active layer and the first conduction layer and the second conduction layer.