Invention Grant
US08357973B2 Inverted-trench grounded-source FET structure with trenched source body short electrode
有权
反沟槽接地源FET结构,具有沟槽源体短路电极
- Patent Title: Inverted-trench grounded-source FET structure with trenched source body short electrode
- Patent Title (中): 反沟槽接地源FET结构,具有沟槽源体短路电极
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Application No.: US13199382Application Date: 2011-08-25
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Publication No.: US08357973B2Publication Date: 2013-01-22
- Inventor: Sik K Lui , François Hébert , Anup Bhalla
- Applicant: Sik K Lui , François Hébert , Anup Bhalla
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee Address: US CA Sunnyvale
- Agent Bo-In Lin
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
This invention discloses bottom-source lateral diffusion MOS (BS-LDMOS) device. The device has a source region disposed laterally opposite a drain region near a top surface of a semiconductor substrate supporting a gate thereon between the source region and a drain region. The BS-LDMOS device further has a combined sinker-channel region disposed at a depth in the semiconductor substrate entirely below a body region disposed adjacent to the source region near the top surface wherein the combined sinker-channel region functioning as a buried source-body contact for electrically connecting the body region and the source region to a bottom of the substrate functioning as a source electrode. A drift region is disposed near the top surface under the gate and at a distance away from the source region and extending to and encompassing the drain region. The combined sinker-channel region extending below the drift region and the combined sinker-channel region that has a dopant-conductivity opposite to and compensating the drift region for reducing the source-drain capacitance.
Public/Granted literature
- US20120025301A1 Inverted-trench grounded-source FET structure with trenched source body short electrode Public/Granted day:2012-02-02
Information query
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