Invention Grant
US08358010B2 Method for realizing a nanometric circuit architecture between standard electronic components and semiconductor device obtained with said method
有权
用于实现标准电子部件与利用所述方法获得的半导体器件之间的纳米电路结构的方法
- Patent Title: Method for realizing a nanometric circuit architecture between standard electronic components and semiconductor device obtained with said method
- Patent Title (中): 用于实现标准电子部件与利用所述方法获得的半导体器件之间的纳米电路结构的方法
-
Application No.: US11817318Application Date: 2005-02-28
-
Publication No.: US08358010B2Publication Date: 2013-01-22
- Inventor: Danilo Mascolo , Gianfranco Cerofolini
- Applicant: Danilo Mascolo , Gianfranco Cerofolini
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed IP Law Group PLLC
- International Application: PCT/IT2005/000110 WO 20050228
- International Announcement: WO2006/090417 WO 20060831
- Main IPC: H01L23/528
- IPC: H01L23/528

Abstract:
A method for realizing a nanometric circuit architecture includes: realizing plural active areas on a semiconductor substrate; realizing on the substrate a seed layer of a first material; realizing a mask-spacer of a second material on the seed layer in a region comprised between the active areas; realizing a mask overlapping the mask-spacer and extending in a substantially perpendicular direction thereto; selectively removing the seed layer exposed on the substrate; selectively removing the mask and the mask-spacer obtaining a seed-spacer comprising a linear portion extending in that region and a portion substantially orthogonal thereto; realizing by MSPT from the seed-spacer an insulating spacer reproducing at least part of the profile of the seed-spacer; realizing by MSPT a nano-wire of conductive material from the seed-spacer or insulating spacer, the nano-wire comprising a first portion at least partially extending in the region and a second portion contacting a respective active area.
Public/Granted literature
Information query
IPC分类: